Book Description
To date I have created the rules for making land patterns used in many thousands of board designs resulting in highly manufacturable assemblies.

In this publication extensive knowledge about design as well as manufacturing is used to bring to you insight about all the aspects I can think of regarding pattern development. It is my intent for you to find this to be the single most comprehensive source of information that will establish a foundation for you and your company to create land patterns with confidence that will serve you very well. For designers this is the definitive source of information. The constant and steady evolution of SMT is faster than organizations like the IPC can keep up with. That void is where SMT Plus has tried its best to be a reliable source of information.

Contained within this publication are over 30 chapters that teach you what you need to know about patterns, standards, rule of thumb, and specific requirements to create land patterns for use either internally or externally. The chapters explain the mechanical information you need for different package and lead types, then explains the rules for developing patterns for each.

My development of land patterns began in 1983 thru extensive testing and experimentation. The constant evolution of technology has changed those old rules and making sure you are current with the effects of lead free solder, silk screens and solder masks is also covered.

Table of Contents

Chapter 1
Early Land Pattern Development

Chapter 2
Requirements of Land Patterns

Chapter 3
Component Standards

Chapter 4
Lead Free Solder Paste Impact on Patterns

Chapter 5
Stencil Apertures

Chapter 6
Solder Mask Opening Requirements

Chapter 7
Silk Screen

Chapter 8
Via in Land Use

Chapter 9
IPC-A-782 Standard

Chapter 10
Workmanship Standard IPC-A-610

Chapter 11
Chip Component Land Patterns

Chapter 12
SO, SON, QFP, L/TQFP Gull Wing Lead Component Land Patterns

Chapter 13
SOT Component Land Patterns

Chapter 14
DPAK/DDPAK Transistor Land Patterns

Chapter 15
Leadless Ceramic Component Land Patterns

Chapter 16
LPN, LPP & MLF Land Patterns

Chapter 17
BGA Component Land Patterns

Chapter 18
Wafer Bump, Flip Chip & CSP Land Patterns

Chapter 19
Electrolytic Component Land Patterns

Chapter 20
Tantalum Component Land Patterns

Chapter 21
MELF Component Land Patterns

Chapter 22
J-lead Component Land Patterns

Chapter 23
RF Active Component Land Patterns

Chapter 24
RF Filter Component Land Patterns

Chapter 25
Resistor Network Component Land Patterns

Chapter 26
Trimmer Component Land Patterns

Chapter 27
Connector Component Land Patterns

Chapter 28
Crystal & Oscillator Component Land Patterns

Chapter 29
LED Component Land Patterns

Chapter 30
Sockets

Chapter 31
Adhesives

Chapter 32
Wave Soldering

Chapter 33
Next Generation Patterns

Chapter 33
UltraLibrarian

Index

Author: James C. Blankenhorn
Edition: August 2003
Pages: 180
ISBN#: 1-882812-40-9

Price: Quote me

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