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Performing Rework and Design on SMT, Fine Pitch and BGA
Book Description
Performing repair/rework on today's assemblies requires a combination
of good tools, good vision, good dexterity, and a new level of knowledge
about techniques. For soldering tools there are a level of knowledge about
techniques. For soldering tools there is a number of solutions available
on the market to do almost any task. Learning how to use the new tools,
learning new techniques, and working smarter are constant challenges.
It is our intent in this book to bring to you the knowledge about types
of tools and the most advanced techniques known today.
The information compiled to put into this book comes from a variety of
sources. A lot of information comes from users, such as yourselves, sharing
new advanced ways of doing things, from personal experience, and from
doing research in this area. Tools and techniques must be practical for
us to want to use them. In some cases we will show you methods and explain
alternatives.
Going from leaded or through-hole parts to SMT is quite a change. There
are changes in the soldering irons, tips shapes, temperature settings,
methods, time allowed to do tasks, how to use each tip shape, and how
to plan your rework/repair.
First, before you start doing SMT soldering, it is highly recommended
that you have a set of workmanship standards for SMT and have read through
them. You must know whether a solder joint or component's positioning
on the board is acceptable or not before soldering.
The fifth edition includes new information on the soldering process, soldering
temperature, different flux types and interactions, cleanliness, standards,
tools, soldering irons, soldering tips, budget planning, techniques, temperature
settings, hot air settings, sockets, connectors and repairing lifted lands.
Who Will Benefit
This book is a must for anyone new or experienced repairing SMT assemblies,
to learn how to become more efficient by doing what others have known,
but wouldn't show you before now.
Table of Contents
1 - INTRODUCTION TO SMT &
SOLDERING
- What Do We Know About PC Board's
- Industry Specifications and Standards
- What Do We Know About Soldering
- Temperature Conversions
- What is Thermal Energy
- Soldering Action
- Intermetallic Bonds & Copper
- What Effects Do Power and Ground
Planes Have?
2 - SMT COMPONENTS
- Chip Components
- SMT Ceramic Chip Resistor Components
- SMT MELF Components
- SMT SOT Components
- SMT SO, SOIC & TSOP Components
- SOJ Packages
- PLCC Components
- Quad Flat Packages (QFP)
- SMT Sockets
- BGA Packages
- Handling & Preparation
3 - SMT ASSEMBLY
- Solder Types
- Soldering Terminology
- Fluxes
- Cleanliness Testing
- Non-Conductive Epoxy & Wave
Soldering
- Assembly Classifications
- SMT Assembly Steps
4 - WORKMANSHIP STANDARDS &
INSPECTION
- SMT Workmanship Standards
- Inspection Methods and Tools
5 - HAND TOOLS & SUPPLIES
- Hand Tools
- Supplies & Chemicals
- Cleaning Solutions
6 - SOLDERING SYSTEMS
- Adjustable Temperature Soldering
Irons
- Programmable Soldering Irons
- Fixed Temperature Soldering Irons
7 - SOLDERING TIPS & TECHNIQUES
- Soldering Temperatures
- Soldering Technique Requirements
- Soldering Tip Shapes & Uses
- Conical Tips
- Hoof Tip
- Blade & Chisel Tips
- Slot Tips
- Tunnel Tips
- Quad Tips
- Flat Blade Tips
- Multiple Tip Irons
- Tip Preference List for Soldering
- Tip Preference List for De-soldering
8 - BGA & HOT AIR TOOLS
- Types of BGA Packages and Leads
- Types of Tools for BGA's
- Soldering BGA's
- BGA Removal Process
- Recycling Used BGA's
- Hot Air Systems for Removal
9- PC BOARD REPAIR
- Repairing Minor Broken Traces
- Repairing Major Trace Breaks
- Opening or Breaking Trace Connections
- Altering Connections to Components
- Adding Components
- Engineering Prototype Repairs
& Rework
- Lifted Land or Pad Repair
10- PREPARING FOR BUILDING PROTOTYPES
- Component Preparation
- Component Handling
- Prototype Assembly Options
Author: James Blankenhorn
Edition: August 1996
Printed: 176 pages 8.5" x 11"
Price:
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