SMT High Density Design and DFM
Book
Description
There are many things we need to know when we get into advanced designs
using SMT. Needed is information for high density design rules, zero defect
designs and a better understanding of the new requirements for "design
for manufacturability". All this is covered in this book
To improve your ability to design with zero defects we have structured the book in a sequence paralleling the designing of the product. You will find the book will prepare you to ask the correct questions at the correct time to prevent redesigns and costly mistakes.
To design high density products, there are several helpful items in this publication. Included in this publication are multiple sets of design rules for standard, high density and ultra-high density designs not published anywhere else. The placement guidelines are very useful as well as information on how to put vias into lands under certain conditions, and how to modify land shapes to gain precious real estate.
Who Will Benefit
This book will be of immense value to both circuit designers as well as
CAD designers, and those involved in product testing, fabrication, troubleshooting
and debug of high-speed products.
Table of Contents
Chapter 1 - Introduction
- Goal, Purpose, Scope
- Categories
- Terms and Abbreviations
- Dimensions
- Reference Documents
- Design Flow
Chapter 2 - Design Project Objectives
- Assembly Types
- Project Initialisation
- Check List
Chapter 3 - Basic Rules of Design for Manufacturing
- Mechanical Restrictions
- Tooling Holes
- Fiducial Specifications
- Panels & Depaneling
- Stencils & Screens
- Parts Optimisation
- Tape and Reels
Chapter 4 - CAE Requirements
- Library Standards
- Test Requirements for SMT
- SMT Packages
- Downloading to CAD Systems
- Schematic Symbols to CAD
- Symbols
Chapter 5 - Rules for Land Patterns
- Land Shapes for Passives
- Land Shapes for ICs
- SOICs and QFP Land Patterns
- J-Leaded Components
- Chip Component Land Patterns
- SOT Components
- Leadless Ceramic IC Components
- Cylindrical Components
- Butt or I Lead Components
- Wave Soldering
- Origin Points
- Lands for RF Circuits
Chapter 6 - CAD Systems
- New Parts
- Non-standard Parts
- Orientation
- Silk Screens
- Test Points
- Fiducial Marks
- Documentation
Chapter 7 - Design for Test
- Schematics
- Bare Board Test
- In-Circuit Test
- Bar Codes
- Edge Connectors
- IC Test Clips
- Bench Level Testing
Chapter 8 - Component Placement and Orientation
- Placement Grids
- Orientation Guidelines
- Standard Design
- High Density
- Ultra-High Density
- Solder Paste Process
- Wave Solder Process
Chapter 9 - Placement Checklist
- New Parts
- Manufacturing
- Test
- QA/QC
- Thermal
- Mechanicals
- Check-off List
Chapter 10 - Design Routing Rules
- Traces
- Lands
- Impedance
- Vias or Holes
- PC Fabrication
- High Density Design Rules
- Fine Pitch Components
- Copper Thieving
- High Speed Signals
- EMI
Chapter 11 - Routing Check List PC Fabrication
- Solder Masks
- Warpage Specifications
- Plating Specifications
- Copper Specifications
- Holes
- Order of Layers
- Fiducial Specifications
- Silk Screen Specifications
- Board Thickness
- Panels for Fabrication
Chapter 12 - Documentation
- Manufacturing
- Test
- PCB Fabrication
Author: James C. Blankenhorn
Edition: June 2001
Pages: full colour 193 pages 8.5" x 11"
Price: Quote me