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Troubleshooting the SMT/FPT Process
Book Description
Troubleshooting the surface
mount process involves several aspects. First there is a requirement to
understand what is judged to be good vs. bad. For an electronic manufacturing
process, such as the soldering of surface mount components to printed
circuit boards, this involves what is commonly called workmanship standards.
The next requirement then is to understand data collection techniques
and statistical process control (SPC) methods, to collect meaningful data
on the problems and other aspects of the process. Finally we need to be
able to establish cause and effect relationships of problems. One can
then quantify the problem vs. corrective action costs. This book is written
to enhance one's ability to understand workmanship standards, troubleshooting
techniques, and cause-and-effect relationships.
To be able to understand and develop
the cause-and-effect relationship of problems, it is also necessary to
understand more about surface mount components, printed circuit boards,
and the basic process. The first chapter of this book provides an overview
of the major components families and some of the issues that are important
for finding and preventing problems. Following this chapter there are
successive chapters on printed circuit boards (PCBs) manufacturing process
flows and details, test, and inspection. There are chapters discussing
the details of workmanship guidelines and troubleshooting methods. This
latter chapter includes both SPC methods and useful information in an
"artificial intelligence/expert system" format. It represents
several years of working with SMT and solving problems to increase yield.
It summarises the important points to understand to facilitate troubleshooting
in a methodical and successful manner.
Troubleshooting in the context
of this book means more than just "finding and fixing" defects.
It also means the prevention of defects, as it is well known that rework/repair
processes, even performed with the best of equipment and procedures, introduces
some reliability risk. Also, troubleshooting means reducing cost and operating
more efficiently, so there are many tips are included to achieve a better
product at lower cost.
This book is written at the intermediate
or advanced level and is an extension of my introductory level book titled:
"Understanding and Using Surface Mount and Fine Pitch Technology",
which you may find helpful on some of the background details.
Who Will Benefit
For personnel involved in working on SMT assemblies and would like to
know what the causes of defects are so they can be solved such as QA,
Process Engineers, and equipment maintenance personnel this is the book
for you.
Table of Contents
Chapter 1 - SURFACE MOUNT COMPONENTS
- Leadless Passive Components
- Leadless Active Components
- Leaded Plastic Components
- Fine Pitch & Ultra-Fine Pitch
Technology
- Package Summary
- Component Requirements
- Component Procurement Requirements
Chapter 2 - PRINTED CIRCUIT BOARDS
- Solderability
- Planarity
- Solder Mask
- Vias
- Standards
- PCB Procurement Requirements
Chapter 3- SURFACE MOUNT PROCESS FLOWS
- Types of process flows
- Type I
- Type II
- Type III
- Standards
Chapter 4 - MANUFACTURING PROCESS
- Printing Solder Paste
- Component Placement
- Reflow
- Clean-up
- Yield Losses
- Process Studies
Chapter 5 - INSPECTION AND TEST
- Inspection Needs
- Inspection Techniques
- Electrical Test
Chapter 6 - GUIDELINES for WORKMANSHIP STANDARDS
- The Need for Standards
- Identifying Failure Modes
- Measurement Accuracy
- Thermal Process History
- Standards Applications
Chapter 7 - TROUBLESHOOTING METHODS
- Necessity for Troubleshooting
- Statistical Methods
- SPC Points for SMT
- Implementing an SPC Program
- Troubleshooting Via Artificial
Intelligence
- Corrective Action and Follow-up
Authors: Charles Hutchins, PhD
Edition: January, 1997
Pages: 100 pages 8.5" x 11"
Price: Quote
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