Book Description
Using solder paste to build SMT assemblies that have leaded components is not something new. By using this technique you may find, as others have, that there are several advantages. Using solder paste for leaded components can simplify the design, improve component density, simplify the process, eliminate equipment, lower manufacturing costs and improve the quality and reliability of the finished product.

To implement using solder paste for leaded components, it begins with the design. It is possible for many older designs to be adapted to this process. But, having the information in this manual for use on new designs will make the transfer to manufacturing a lot easier than trying to retrofit the design to the process.

Using solder paste to its full advantage we can fill vias that are exposed. The vias may be test pads with open vias or plated holes that have leads of components protruding through them.

For a complex, high density double-side mounted assembly, this process can have a significant impact. By elimination of wave soldering, we have many advantages. The component density can be much higher using solder paste. The component limitations of the types of components that we put on the wave solder side of the board are enhanced by using solder paste.

Included with this book is a floppy disk that operates using the latest Excel programs to assist in calculations necessary to apply to your designs.

Author: James C. Blankenhorn
Printed: 1995

Price: Quote me

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