Who Will Benefit:
Anyone involved in the transition to Pb free should take this highly informative course. If you are involved in any area of board or assembly manufacturing, components, design, quality, test or sales this will help you immensely in your understanding of the issues and possible solutions of moving to Pb free.
About the Course/Book:
Our industry is making one of its most challenging and evolutionary steps in going from SnPb to Pb free products. The issues are many and they must be well understood to avoid costly mistakes or misspoken statements. In this course you will learn the most critical pieces about the transition to Pb free. It is the most extensive and broadest coverage of this topic available anywhere.
The transition to Pb free first starts with understanding the directives and global trends. Then learn about the possible alloy replacements, their pros and cons along with the environmental considerations and reliability; each backed up with testing and data. The PWB finishes are dealt with in detail covering a wide range of optional finishes. That is followed by what the effects are of intermixing different board finishes, PWB plating types and solder alloys: addressing both forward and backward compatibility. Next, another important topic, tin whiskers are explained in a detail not seen anywhere else. Now you are only half way through!
The next section gets into failure modes such as CAF, causes and solving tombstoning and voids, Pb free printing issues, Pb free reflow profiles (old compared to new recommendations) and how they relate to a variety of defects during reflow that can be solved by making slight changes. Learn what Motorola gained from extensive testing such as drop tests. Finally one more very important topic is covered, wave soldering. It covers topics such as tin pest, tin corrosion, fluxing, setup and the optional pin in paste process
Detailed Course Outline
Module 1: Lead Free Initiatives and Global Trends
The electronics industry has been mandated to convert to lead free products per two directives: WEEE and RoHS. How these changes are coming about and how the segments of the world are dealing with this are presented along with graphs showing the status.
* What is the industry size?
* What is the industry breadth?
* What you do is important.
* Where is the market?
* How about electronics and the environment?
* A major change?
* What is the WEEE Directive?
* List the categories of electronics included.
* What is the RoHS Directive?
* List the categories of electronics included.
* What are the RoHS Exemptions?
* So what does this mean?
* What are some of the logistical concerns?
* What are the steps you can take?
* What about China RoHS?
* What about USA RoHS?
* What are Japanese "Green" products?
* Why is PB-free only a piece of RoHS compliance?
Top
of page
Module 2: Lead Free Alloy Selection
The selection of a replacement for SnPb is at the heart of the issues confronting many in transitioning to lead free. The alloy options being considered by most, their cost implications, SAC alloys choices and what the industry are mainly favouring are presented.
* Solder as it is today.
* List the desirable lead free characteristics.
* List the lead free paste options.
* What is the impact on paste costs?
* What are drop-in solutions?
* List some of the lead free paste options.
* What is the problem with 91Sn9Zn?
* What is the problem with 96.5Sn3.5Ag?
* How about SAC alloys?
* How about SnAgCuSb?
* How about 58Sn42Bi?
* How about SnAgBi?
* What are the SnAgBi concerns?
* What looks like the industry choice?
* What are the SAC concerns?
* What are the things to remember?
Top
of page
Module 3: Is Lead Free a Good Thing?
Changing to lead free has environmental considerations, so why are we targeting eliminating Pb anyhow? So of the lead free alloy choices what makes the most sense is covered.
* What are the environmental implications?
* List the sources of environmental lead.
* Why target Pb in WEEE?
* What about lead free solder alloys?
* What is the decision?
* Is lead free a good thing?
Top
of page
Module 4: Lead Free Alloy Reliability
The change to another alloy from SnPb means we have to address the reliability of any possible choice. Thermal testing has been performed on many such choices and is presented as well as mechanical testing and out of plane bending.
* Why worry about reliability?
* What about thermal cycling performance?
* What about thermal fatigue for BGAs?
* What about creep?
* What does isothermal mechanical cycling include?
* When is out of plane bending a problem?
* Describe mechanical shock?
* Summarization of the technical considerations.
Top
of page
Module 5: Lead Free Components
Using lead free components with SnPb and vice versa is of concern and can cause problems, so understanding forward and backward compatibility are necessary pieces to the lead free transition puzzle. Learn how tin whiskers are created and on what surfaces along with what it takes to prevent them. It is vital for components the labels need to tell us which are SnPb and which are Pb-free.
* What do you need to know about lead free components?
* What are the component finish options?
* What about Sn whiskers: growth?
* What about Sn whiskers: intermetallic formation?
* What is copper diffusion: increasing whisker growth?
* What is the whisker index?
* Explain about Sn whiskers: CTE mismatch.
* What about Sn whiskers: other causes?
* What about Sn whiskers: mitigation?
* What about reliability of various component finishes?
* How to make the switch.
* How about forward/backward compatibility?
* What about component suppliers?
* What are the labeling issues?
* What are other component concerns?
* List other component concerns.
* What is the cost impact?
Top
of page
Module 6: Lead Free Surface Finish
There are many choices when it comes to PWB finishes. Some choices are much better than others. In this section this is presented showing the pros and cons of each along with a summary table comparing them all.
* Why the surface finish requirements?
* What is the industry choice for surface finish?
* What about Pb-free HASL? (Hot Air Solder Level)
* What about ENIG? (Electroless Nickel Immersion Gold)
* What about using OSP? (Organic Solder Preservatives)
* What about using IAg? (Immersion Silver)
* What about using ISn? (Immersion Tin)
* Surface finish comparison.
* Summary of different finishes.
Top
of page
Module 7: Failure Modes
The alloy changes in going to Pb-free cause old problems to reappear but for new reasons. Tombstoning and voids are the recurrent defects that can be controlled once you understand the causes, which is detailed in this section.
* What is conductive anode filament growth (CAF)?
* What causes tombstoning?
* What are the tombstoning rates?
* What can be done to minimize tombstoning?
* What about mixed alloys?
* What is voiding?
* How do the alloys compare for voiding?
* How can you prevent voiding in reflow?
* What causes voids in vias?
* What are the inspection issues?
Top
of page
Module 8: Implementation
Implementing Pb-free and how the industry stands is an issue. ELFNET did a survey to show where companies stand and it is eye opening to see how much work has yet to be completed by many. To assist those in need an assessment tool is included to rate where your company is in the changeover process.
* What is the European lead free survey?
* What about the ELFNET survey?
* What is the current status of EU Pb-free?
* Where is a Pb-free readiness assessment tool?
* What is the Pb-free RAT?
* WEEE/RoHS experts are valuable.
* What to think about for your BOM?
* How do you work with your suppliers?
* How to go about choosing a new paste?
* What percent are RoHS compliant suppliers?
* What are homogenous materials?
* How do you do planning for review?
Top
of page
Module 9: Lead Free Printing and Placement
Printing lead free paste creates new challenges. The quality of the print, paste selection, response to pause, viscosity considerations, tackiness, stencil life, shear thinning, solder balling and stencil design are each covered in this section. The changes are subtle but the effects are major.
* What is the approximate distribution of process related defects?
* How many factors affect your print quality?
* What is Motorola's process criteria?
* How do you do a paste evaluation and selection strategy?
* What items are related to your paste selection?
* What are paste responses?
* What is the paste evaluation?
* What's the 12 board paste evaluator?
* What are the effects of viscosity?
* What are the effects of viscosity and temperature?
* What is the Motorola flux tackiness measurement?
* What is the effect on solder paste stencil life?
* What are the effects of short stencil life?
* What was the objective of the Motorola stencil printing evaluation?
* What was the result of response to pause test?
* What are the effects of poor response to pause?
* How do you go about measuring shear thinning effect?
* What is the solder paste resistance to shear thinning?
* Why worry about solder balls in passive assembly?
* What are poor gasketing results?
* Why the importance of wall/pad ratio?
* What changes for stencil design?
Top
of page
Module 10: Lead Free Reflow
Changes are required in the reflow profiles to achieve optimum results when changing to different alloys replacing SnPb. The affects of the profile on 8 different common defects is presented so you may learn the cause and solution for each. Also included is a recap of the results Motorola found during their extensive analysis.
Top
of page
* What is the approximate distribution of process related defects?
* What is crucial for lead free reflow?
* What are the (old) RDRP profiles?
* What changes for the (new) convection ovens?
* What is unique about the (old) IR oven profile design?
* What is different about the (new) convection oven profile design?
* What are the unique profiles and defect mechanisms?
* Explain defect mechanism analysis 1.
* Explain defect mechanism analysis 2.
* Explain defect mechanism analysis 3.
* Explain defect mechanism analysis 4.
* Explain defect mechanism analysis 5.
* Explain defect mechanism analysis 6.
* Explain defect mechanism analysis 7.
* Explain defect mechanism analysis 8.
* Reflow profile summary.
* Recap of the Motorola reflow profile evaluation.
* What was the coalescence?
* Compare reflow profile and coalescence.
* How about the wetting?
* State Motorola's conclusion.
Top
of page
Module 11: Lead Free Reliability Issues
There are important reliability considerations when evaluating different alloys to replace SnPb. Data is presented from Motorola which did extensive testing for reliability using a test vehicle to evaluate mechanical and thermal shock.
* Understand the reliability of Pb-free.
* What was the Motorola reliability evaluation?
* What was the Motorola test vehicle?
* What was the Motorola drop evaluation?
* What was the Motorola thermal shock evaluation?
Top
of page
Module 12: Lead Free Wave Soldering & Alternative Soldering Methods
The effects of changing alloys on the wave soldering process are significant. It affects both the equipment and the process. The results are the effects of tin pesting and corrosion. So what is the industry switching to? That plus fluxing, setup and dwell time is explained to complete the transition.
* Which components get wave soldering?
* List some lead free wave challenges.
* What is tin pest?
* When does tin corrosion occur?
* What are the industry lead free wave recommendations?
* What is crucial about fluxing?
* List the lead free wave setup rules of thumb.
* How do you calculate dwell time?
* What is the Pin-in-Paste (PIP) process?
* What are the PIP concerns?
* How do you do the PIP stencil design?
* What are PIP stencil design steps 1 & 2?
* What is PIP stencil design step 3?
* What is PIP stencil design step 4?
* Show some common PIP stencil designs.
* Show a poor PIP stencil design.
* What are solder preforms?
* What are some PIP considerations?
* What to consider in PIP solder paste selection.
* What is an option for PIP stencil printing?
* What about PIP component selection?
* State the lead free wave and alternative soldering methods summary.
Top
of page
| Product |
|
Duration |
Price |
| |
|
|
|
Online
Curriculum Only
|
Each student has a password and file giving them
unlimited access to the online curriculum including all 12 courses for 1 year.
|
8
Hours |
|
|
Course
Book Only
|
Printed
in full colour. |
|
|
|
!!
Special Offer !!
Online Curriculum + Course Book bundle
|
Includes
both the course book and online training course with unlimited access
for 1 year. |
|
|
|
TE0020
